Last month we heard rumors that the Huawei Mate 30 could be the first smartphone with a chipset built on the EUV process, and now media representatives in Taiwan confirm the information. Not only that, but Huawei’s chip manufacturer HiSilicon will implement 5G modem in all the chips, effectively making all future Huawei flagships 5G-compatible.

The new processor will be manufactured using the FC-PoP method (FlipChip Package-on-Package), which allows vertical stacking of transistors. Combined with the Extreme UltraViolet process, the transistor density will be increased by 20% -…